TBF has novel encapsulated reactive nanoparticles that are capable of plugging the defects of porous barrier films. These nanosealing materials are a key component for TBF's high barrier films.

The TBF nanosealing materials can be tuned for various applications, and various functions such as UV blocking, weatherability, anti-reflection can be incorporated.

TBF’s core technology is its nanosealing material and barrier stack technology deposited on flexible substrates. Defects such as pinholes, cracks and grain boundaries are common in thin oxide barrier films when fabricated onto plastic substrates. TBF has taken an innovative approach to resolve the ‘pore effect’ by literally plugging the defects in the barrier oxide films using nanoparticles. This reduces the number of barrier layers needed in the construction of the barrier film. TBF’s barrier stack consists of barrier oxide layers and nanosealing layers. The nanoparticles in used in the barrier film have a dual function ‐ not only sealing the defects but also actively reacting with and retaining moisture and oxygen.

Breakthrough moisture barrier performance of better than 10^‐6 g/m².day, or one millionth of a gram per square meter per day has been obtained. The barrier film also has a lag time of more than 2,300 hours at 60°C and 90% RH (i.e. the time required for moisture to pass through the barrier film under those conditions).

We provide various ranges of flexible barrier films from 10^-1 to 10^-6 g/m².day

• An impediment in developing ultra-high barrier substrate has been the availability of an appropriate testing methodology.
• In-house testing method has been used to study the water permeation through the defects in barrier films using calcium sensor
• Either optical or electrical measurement method can be utilised to monitor Ca sensor degradation with time
• Quantitative measurements of water vapour transmission rates and diffusion coefficients can be obtained using this method

The high speed manufacturing technology can significantly reduce the cost and therefore, TBF can cover the low-end applications and enhance the lifetime of the products and devices at lower cost.

TBF has several IPs relating to device encapsulation which can be adapted to specific applications and requirements.

• Root cause analysis to understand the failure of devices are critical for the development of new materials and device architectures.
• We have developed a method to incorporate sensors into the device packages so as to continually monitor the degradation of the package under accelerated conditions
• The rate of change of Ca resistance & 1/f noise is measured and converted as WVTR under steady state conditions. The measurement sensitivity is better than 10^-6g/m².day